A novel silicon-based suspended MIM capacitor fabrication technique combining thin-film and bulk silicon etching technologies with high-quality factor is presented. The influence of low resistive silicon on the parasitics of integrated capacitors is analyzed by EM simulation. The suspended structure is achieved and optimized by a two …
A novel silicon-based suspended MIM capacitor fabrication technique combining thin-film and bulk silicon etching technologies with high-quality factor is presented. The influence of low resistive silicon on the parasitics of integrated capacitors is analyzed by EM simulation. The suspended structure is achieved and optimized by a two …
Focused ion beam (FIB) technology makes use of a highly-focused beam of charged ions to perform precise nanopatterning tasks by steering it over a sample, tracing patterns defined by the user. The physical interactions between the ions and the ...
This study presents a comprehensive overview of in-mold process monitoring tools and methods for injection molding process control. It aims to survey the …
Glass molding has become the most effective and efficient method for the high-precision manufacturing of micro/nanostructures on glass surfaces and is implemented on a molding machine. For instance, as shown in figure 2, the PFLF7-60A molding machine (produced by SYS, Japan) consists of a heating module, pressurizing module, and …
Injection moulding is an extremely important industrial process, being one of the most commonly-used plastic formation techniques. However, the industry faces many current challenges associated with demands for greater product customisation, higher precision and, most urgently, a shift towards more sustainable materials and processing. …
Additive manufacturing, also known as 3D printing, is a revolutionary manufacturing technology. This paper compares the differences between additive manufacturing technologies, such as Fused Deposition Modeling, Selective Laser Sintering, Selective Laser Melting, Stereolithography, Layered Object Manufacturing, and traditional …
This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication …
The application process gets the epoxy coating powder to look how it should, but the curing process ensures that the epoxy coating powder behaves as it should. It is this post mold curing that brings the curing percentage from 80% up to 99.9% cured and this in turn determines the epoxy coating powder''s final properties such as hardness, …
This paper reports on the design and fabrication of a 4-bit switched capacitor bank designed to operate over the frequency range of 3-10 GHz with a tuning range of up to 10:1. An optimized mask-less CMOS post-processing technique is used to fabricate the 0.6 mm × 0.9 mm capacitor bank. We propose a procedure employing dry etching with cryogenic …
8.2: Capacitors and Capacitance
9.2.2 High-Energy Beam Lithography9.2.2.1 Electron Beam Lithography Electron beam lithography (EBL) is one of the main technologies for the creation of nanoscale patterns. An electron sensitive resist, such as …
It is difficult to obtain uniform capacitance over full area of wafer without any capacitor-related failure in mass production. In this study cross DPT is used in order to enlarge capacitance without storage node bridge failure. Fig. 7 shows cross sectional transmission electron microscope (TEM) images of cell capacitor using DPT.
After forming storage materials cylinder type capacitor is formed by lift-off process to remove the mold oxide between capacitors. Finally dielectric films are deposited and TiN film is deposited as top electrode. Download …
To realize an extremely sensitive MDPS with broad application potential, including in medical ventilators and fire residual pressure monitors, the "beam-membrane …
Advances in high-performance MEMS pressure sensors
A MOS capacitor is built using a process technology where the oxide thickness is t o x = 9 nm. The permittivity of silicon is ϵ o x = 3.9 ϵ 0 = 3.9 × 8.85 × 1 0 − 12 F / m The size of the capacitor is L = 80 μ m by W = 120 μ m .
As a typical example of molding technologies, the precision glass molding (PGM) process is first introduced and analyzed, as are the extreme requirements of the …
Multiple In-Mold Sensors for Quality and Process Control ...
To overcome the limitations of solution-based processes, shadow masking is becoming a standard technique for patterning low-molecular-weight materials (e.g., …
Modern capacitor technologies generally retain the potential for increased power and energy densities by factors of 2–10 times, depending upon the specific technology. Implementation of these potentially ever more compact designs rests primarily upon cost consideration in the consumer, commercial, and industrial sectors.
By adopting rapid prototyping technology, such as using aluminum molds or 3D printed molds, we can quickly and economically manufacture prototype molds. This method not only accelerates the production speed of prototype components, but also ensures that these prototype components are very close to the final production components in terms of …
Micro- and nanopatterns perform unique functions and have attracted attention in various industrial fields, such as electronic devices, microfluidics, biotechnology, optics, sensors, and smart and anti-adhesion surfaces. To put fine-patterned products to practical use, low-cost patterning technology is necessary. Nanoimprint lithography (NIL) …
To further enable capacitor scaling, Applied launched a novel hard mask called Draco in 2021. Draco is a new material that increases etch selectivity by more than …